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ICF
Device |
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 |
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Used for the Evacuation process of electronic
vacuum devices
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Ultimate pressure: below 3¡Á10 -7Pa ¡« 5¡Á10 -9Pa
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Oven temperature: 600¡æ £¬ program control with
the precision¡À 1¡æ
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Single, double, and multiple (3~14) stations
possible
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Different size baking chamber combinations
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 |
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Used
for the de-gasing and brazing process of electronic
vacuum devices and components |
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Ultimate
pressure lower than 5 * 10-4
Pa |
|
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Oven
temperature:1300¡æ.Program control with the precision
¡À 2¡æ |
|
|
Varisized
vacuum chamber |
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|
 |
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Including de-gasing equipment, cathode analyzing
equipment and cathode storing equipment , etc.
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High efficiency vacuum system
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HF de-gasing system
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Cathodes
emission measurement setup |
|
 |
|
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Used for storing vacuum components
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|
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Turbo
pump provides clean storage space |
|
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Data
record ability: time vs time, pressure, temperature
and humidity |
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Number
of vacuum chambers: 3, 4, or 12 |
|
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Each
vacuum chamber can be controlled separately |
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|
Vacuum
threshold pre-settable |
|
 |
|
|
Space Environment Simulation System
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Four Targets Magnetron Sputtering System
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Large
Vacuum Lab Equipment |
|
|
Plasma
System For R&D |
|
|
Ultra-high
Vacuum Evacuation Parts |
|
 |
|
|
Optical filters
|
|
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Vacuum system with precision dosing control
|
|
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Plasma
Diagnose Equipment |
|
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Surface
Speciality R&D |
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Key National Research Projects
